Look-up in Google Scholar
Full metadata record
Huamanchahua Canchanya, Deyby Maycol (es_PE)
Huamanchahua Canchanya, Deyby Maycol (es_PE)
Valenzuela Lino, Yadhira Samhira (es_PE)
Moggiano Aburto, Nabilt Jill
Cuyubamba Povez, Patrick Albino (es_PE)
Asto Evangelista, Joel (es_PE)
Almerco Ataucusi, Jean Raul (es_PE)
2023-05-31T01:22:30Z
2023-05-31T01:22:30Z
2023-05-31T01:22:30Z
2023-05-31T01:22:30Z
2022
Institute of Electrical and Electronics Engineers (journal)
https://doi.org/10.1109/ICPSE56329.2022.9935347 (doi)
Cuyubamba, P., Asto, J., Almerco, J., Valenzuela, D., Huamanchahua, D. y Moggiano, N. (2022). Design and performance study of the heat exchanger of a fin-based thermoelectric generator via numerical simulations. Tesis para optar el título profesional de Ingeniero Mecatrónico, Escuela Académico Profesional de Ingeniería Mecatrónica, Universidad Continental, Huancayo, Perú (es_PE)
https://hdl.handle.net/20.500.12394/12970
Climate change is a latent concern nowadays, so the ONU proposed to adopt new alternatives for obtaining energy through clean and renewable energies; that is why the TEG (Thermoelectric Generator) have been used in different industries and vehicles as they are a system that recovers and uses the waste heat from automobile exhaust gases for waste heat recovery; therefore, it is a method that allows improving energy efficiency. The present study aims to design and study the performance of the heat exchanger of a fin-based thermoelectric generator via numerical simulations. In this way, the geometry was performed using SolidWorks software. In addition, the meshing and boundary conditions were established in ANSYS Fluent to obtain the initial temperature distributions. Additionally, these initial temperature distributions serve as boundary conditions for ANSYS Thermal-Electric to obtain the semiconductor's final temperature distributions, voltage distributions, and electric current distributions. It was obtained as a result that the semiconductor's temperature distributions reached a voltage of 80 mV in 1 second of heat transfer. Also, the droplets fin-base TEG had an average temperature of 36.85 °C on the cold side and 163.3 °C on the hot side. Finally, it was concluded that the semiconductor’s final temperature distributions of the hot and cold side for the droplets fin-base TEG presented higher uniformity than the parallel plate fin-base TEG. (es_PE)
application/pdf (es_PE)
2 páginas (es_PE)
eng (es_PE)
Universidad Continental (es_PE)
https://ieeexplore.ieee.org/document/9935347 (es_PE)
info:eu-repo/semantics/restrictedAccess (es_PE)
Acceso restringido (accessRights)
Repositorio Institucional - Continental (es_PE)
Universidad Continental (es_PE)
Simulación (es_PE)
Calor (es_PE)
Design and performance study of the heat exchanger of a fin-based thermoelectric generator via numerical simulations (es_PE)
info:eu-repo/semantics/bachelorThesis (es_PE)
Universidad Continental. Facultad de Ingeniería. (es_PE)
Ingeniería Mecatrónica (es_PE)
Ingeniero Mecatrónico (es_PE)
PE (es_PE)
https://purl.org/pe-repo/ocde/ford#2.02.02 (es_PE)
https://purl.org/pe-repo/renati/level#tituloProfesional (es_PE)
44878371
https://orcid.org/0000-0003-0726-4765 (es_PE)
74466185
42896174
71665906
73105932
44878371
45103226
713096 (es_PE)
https://purl.org/pe-repo/renati/type#tesis (es_PE)
Privada societaria
info:eu-repo/semantics/publishedVersion (es_PE)



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.